320×240混合式非制冷红外焦平面探测器芯片工艺研究  

Study on Processing of 320×240 Hybrid UFPA

作　　者：许娅明[1] 任华[1] 

机构地区：[1]昆明物理研究所,云南昆明650223

出　　处：《红外技术》2010年第1期1-5,共5页Infrared Technology

摘　　要：热释电非制冷红外探测器具有成本低廉、无需制冷等优异特点,在红外探测和红外成像领域占有极其重要的地位。从热释电非制冷焦平面探测器的晶片制备、红外吸收结构设计、倒装互连等关键工艺的研究进行了阐述,其研究试验最终实现了320×240的成像演示。High performance and inexpensive pyroelectric infrared detectors play an important role in the field of thermal detection and imaging of objects, because of the advantages of high sensitivity at long-wavelength and room-temperature operation without cooling system. This paper focused on production of PZT wafer, design of infrared absorber structures, hybrid-integrated, and so on. The good thermal image of this new 320×240 pyroelectric UFPA had been obtained.

关 键 词：混合式 热释电 非制冷红外焦平面 工艺流程 

分 类 号：TN215[电子电信—物理电子学]