基于ANSYS10.0的管道瞬时液相扩散连接有限元数值模拟  

Numerical Simulation of Transient Liquid-Phased Bonding Based on ANSYS 10.0

作　　者：王海瑞[1,2] 李安铭[1] 梁峰[1] 

机构地区：[1]河南理工大学材料科学与工程学院,河南焦作454000 [2]焦作市迈科冶金机械有限公司,河南焦作454000

出　　处：《热加工工艺》2010年第1期134-135,138,共3页Hot Working Technology

摘　　要：采用有限元分析软件ANSYS10.0对管道瞬时液相扩散连接接头处的残余应力分布进行数值模拟。结果表明,在冷却的初始阶段,焊缝及两侧的母材处的应力急剧下降,残余应力在此产生;冷却后,焊缝处应力下降,且低于两侧母材处的应力;其连接接头的最大应力出现在靠近焊缝两侧的母材上,中间层可以缓和应力的分布。The numerical simulation of residual stresses in transient liquid-phase bonding（TLP） of pipeline was carried out by ANSYS 10.0. The restults show that, the residual stresses occurs at the initial stage of cooling, because the stresses of weld and near base materials sharply decline; after cooling, the weld stresses drop, and lower than the both sides of the base metal; the maximum stresses of TLP joints in the base metal occurs on both sides of the near weld, intermediate layer can relieve the distribution of stresses.

关 键 词：有限元 残余应力 瞬时液相扩散连接 

分 类 号：TG453.9[金属学及工艺—焊接]