脉冲电镀铬的研究现状与展望  

Research Status and Future Prospects of Chromium Pulse Electroplating

作　　者：冯辉[1] 袁萍萍[1] 张琳[1] 徐莉[1] 邓秋芸[1] 张勇[1] 桂阳海[1] 

机构地区：[1]郑州轻工业学院材料与化学工程学院,河南郑州450002

出　　处：《电镀与精饰》2010年第1期20-23,共4页Plating & Finishing

摘　　要：回顾了近年来脉冲电镀铬的技术研究现状,综述了脉冲电镀铬的特性,脉冲电镀得到的铬镀层结构不同于直流镀层,其孔隙率低,裂纹数目少,双向脉冲电镀铬可在电镀过程中不断修饰镀层表面,在特定条件下还可获得多层纳米晶结构,可大幅度改善镀铬层的抗腐蚀性能。The research status of chromium pulse electroplating was reviewed,and characteristics of the chromium plating were summarized.The structure of the chromium plating layer with pulse electrodeposition technology was different from the plating layer with direct current electrodeposition technology,such as that the former one has lower porosity and the fewer number of cracks.It was showed that the technology of chromium electroplating with reverse-pulse current could continuously modify the surface of electrodeposition layer during plating process,which might result in that a multi-nanometer layer of structure was formed and the corrosion resistance of the plating was dramatically improved.

关 键 词：脉冲电镀 电镀铬 耐腐蚀性 

分 类 号：TQ153.11[化学工程—电化学工业]