缩合型有机硅电子灌封材料之固化体系研究  

Study on the Cure Behavior of Condensation Type Silicone Gel for Electronic Encapsulation

作　　者：钟冬晖[1] 崔少伟[2] 向洪平[2] 葛建芳[2] 

机构地区：[1]茂名学院,广东茂名525000 [2]仲恺农业工程学院,广东广州510000

出　　处：《河北化工》2010年第1期31-34,共4页Hebei Chemical Industry

摘　　要：以二丁基二醋酸锡(D-70)为催化剂,分别以二甲基二乙氧基硅烷、三乙氧基硅烷、正硅酸乙酯、硅酸乙酯-40(Si40)及其混合物作为固化剂,比较了不同固化剂对硅凝胶表干时间和硬度的影响。结果表明,室温下采用三乙氧基硅烷固化速度很慢,而采用正硅酸乙酯和正硅酸乙酯低聚物Si40时固化速度相近,凝胶硬度也相差不大。对混合固化剂来说,二甲基二乙氧基硅烷与正硅酸乙酯配伍较好(质量混合比例在1左右)。该催化固化体系可用于快速电子灌封凝胶的制备。Dibutyltin diacetate （D-70） was used as catalyst, the effects of different curing agents such as dimethyldiethoxysilane, triethoxysilane, ethyl orthosilicate, ethyl orthosilicate oligomer （Si 40） and their mixtures on the surface drying time and hardness of silicone gel were investigated. The results indicated that the curing rate of triethoxysilane was lower than that of ethyl orthosilicate and Si 40. When ethyl orthosilicate and Si 40 used respectively, the difference of curing rate and hardness of the obtained gel were not significant. When the mass ratio of dimethyldiethoxysilane to ethyl orthosilicate was about 1, the two-component mixture showed the best curing properties. The obtained catalytic vulcanization system can be used in the preparation of electronic encapsulation gel.

关 键 词：硅橡胶 灌封 催化剂 固化剂 

分 类 号：TQ314.256[化学工程—高聚物工业]