双向脉冲电铸镍的研究  

A Study of Ni Electroforming by Bidirectional Pulse

作　　者：庞梅[1] 李洪友[1] 李哲煜[2] 江开勇[1] 黄超[1] 

机构地区：[1]华侨大学机电及自动化学院,福建泉州362021 [2]空军航空大学,吉林长春130022

出　　处：《电镀与环保》2010年第1期11-14,共4页Electroplating & Pollution Control

基　　金：国家自然科学基金项目(50675072);福建省工业科技重点项目(2008H0028)

摘　　要：阐述了脉冲电铸的机理。应用双电层及双扩散层原理,从微观角度解释了脉冲电铸相比于直流电铸,双向脉冲相比于单向脉冲、正负脉冲的优点;通过实验分析了各主要工艺参数影响电铸过程的规律。实验结果表明:双向脉冲电铸能够显著地改善铸层质量,提高电铸零件的机械性能。The mechanism of pulse electroforming is described. Utilizing the principles of double electric layer and double diffused layer, the advantages of pulse electroforming compared with direct current electroforming, the advantages of bidirectional pulse compared with unidirectional pulse and positive-negative pulse are explained from micro point of view. The laws of the major technological parameters influencing the process of electroforming are analyzed and studied. According to the results of bidirectional pulse electroforming experiment, the bidirectional pulse electroforming can dramatically improve the quality electroforming deposits and the mechanical properties of electroformed parts.

关 键 词：脉冲电铸 镍 双向脉冲 

分 类 号：TQ153[化学工程—电化学工业]