CVS技术在监控电镀铜槽液中的运用  

Application of CVS Technology to Monitor Copper Plating Bath

作　　者：傅琼利 

机构地区：[1]贝加尔化学,广东汕头515065

出　　处：《印制电路信息》2010年第2期65-69,共5页Printed Circuit Information

摘　　要：介绍CVS技术在监控电镀铜槽液中有机添加剂的运用。文章首先将对电镀铜中的有机添加剂和CVS技术的电化学原理进行解说,然后对CVS分析仪对有机添加剂浓度进行测量的原理和CVS中有机添加剂程序的创建进行介绍,最后简要介绍CVS在有机添加剂来料查验、镀液污染值、碳处理情况等监控方面的运用,希望此文章能够对CVS化验分析人员对此仪器有更深一步的了解。To introduce the CVS technology in the monitoring of organic additives of copper plating bath .Firstly, this article will explain the organic additives of copper plating and the electrochemical principle on CVS techniques.Secondly, the principle of CVS analyzer to measure the concentration of organic additives and the creation of procedure in CVS analyzer are introduced. Finally, it will briefly introduce the application of CVS analyzer to monitor the organic additive incoming inspection, bath pollution value, carbon treatment process. I hope this article will help analysiser to understand the equipment more.

关 键 词：有机添加剂 酸性镀铜液 循环电位剥离分析仪 电位 

分 类 号：TN41[电子电信—微电子学与固体电子学]