台式计算机液态金属冷却系统设计及评估  

Design and Evaluation of a Liquid Metal Cooling System for Desktop Computers

作　　者：谢开旺[1] 刘明[1] 饶伟[1] 刘静[1] 周一欣[1] 

机构地区：[1]中国科学院理化技术研究所低温工程学重点实验室,北京100190

出　　处：《计算机工程与科学》2010年第3期155-158,共4页Computer Engineering & Science

基　　金：国家自然科学基金资助项目(50576103)

摘　　要：针对高集成度计算机芯片产生的高热流问题,常规的散热方法如空气冷却、水冷等已达到其冷却极限,近期液态金属芯片散热方法的提出为解决上述难题提供了新的可能。本文研制出一套可用于台式电脑的液态金属冷却系统,并对其联机后的实际应用性能进行了初步评估,测试结果表明液态金属冷却系统能有效地将台式计算机产生的热量带走。本文的工作系液态金属散热方法运行于实际计算机热管理的首次报道,可望为液态金属芯片散热技术的进一步实用化打下基础。With the rapid development of highly integrated computer chips, tremendous heat generation in the closet has become a major concern for thermal management. At present, conventional thermal management schemes such as air-cooling and liquid cooling have reached their application limits. The proposition of a liquid metal chip cooling method opens new possibilities for solving the above tough issues. In this paper, a liquid metal cooling system is designed and integrated into a desktop. Its practical cooling capacity is evaluated. The results demonstrate that the liquid metal cooling system can effectively dissipate the heat generated By the desktop computer. The present work provides a basis for further developing the liquid metal cooling technology which can actually be used in reality. This is the first report for the application of the liquid metal cooling method in a practical computer.

关 键 词：芯片散热 热管理 液态金属 台式机 微纳米电子 强化传热 

分 类 号：TP305[自动化与计算机技术—计算机系统结构]