导电薄膜热膨胀系数实时测试系统  

Real-Time Testing System of Thermal Expansion Coefficients for Conductive Thin Films

作　　者：王静[1] 李洪来[2] 刘美华[3] 蔺金太[1] 

机构地区：[1]解放军军事交通学院基础部,天津300161 [2]河北工业大学机械工程学院,天津300130 [3]天津商业大学机械工程学院,天津300134

出　　处：《机械工程材料》2010年第1期58-60,100,共4页Materials For Mechanical Engineering

基　　金：国家自然科学基金资助项目(10402022)

摘　　要：开发了一种导电薄膜热膨胀系数的实时测试系统,即显微成像与数字图像相关方法相结合的测试系统。利用该系统在线实时测定了SnO2导电薄膜的热胀系数随温度变化的关系曲线,并进一步可得到膜与基体间应力的变化规律。结果表明:该系统能较准确地测出SnO2薄膜与陶瓷基体各向异性的热膨胀系数;根据试验结果及现有理论可以计算出基体与膜之间的最大应力以及基体内部的应力随温度的变化情况。An on-line real-time system for measuring thermal expansion coefficients of conductive thin films was developed, which was combined with the micro-imaging and digital image correlation method. The relation curves of thermal expansion coefficients of SnO2 thin films with the temperature were determined and the stress changes between the film and substrate could also he obtained further by the system. The results show that the system accurately determined the anisotropy of thermal expansion of the SnO2 thin film and ceramic substrate. According to the experimental results and existing theories, the maximum stress between the films and substrate and the changes of the stress inside the substrate could be calculated.

关 键 词：SnO2导电薄膜 显微成像 热膨胀系数 

分 类 号：TB302.5[一般工业技术—材料科学与工程]