采用电磁带隙和磁性材料的PCB电源结构  

A power bus structure in PCBs using EBG and magnetic materials

作　　者：李杰[1] 卞正才[1] 张婧婧[1] 王志良[1] 

机构地区：[1]复旦大学通信科学与工程系,上海200433

出　　处：《信息与电子工程》2010年第1期19-22,共4页information and electronic engineering

摘　　要：在印制电路板的设计中,供电系阻抗谐振所引起的噪声和电磁干扰问题一直是设计人员关注的焦点。已有的研究显示,适当的电磁带隙(EBG)结构可以有效地降低供电系的电磁干扰。本文通过运用基于快速算法和分解元法的计算机仿真,研究供电系EBG结构中采用磁性材料后的阻抗特性。研究表明,在供电系内侧增加磁性材料涂层,能在原有基础上进一步抑制电磁干扰。Power bus noise problem and Electromagnetic Intefference（EMI） problem caused by resonant impedance have become a major concern for Electromagnetic Compatibility（EMC） engineers engaged in Printed Circuit Board（PCB） design. Previous researches have shown that proper Electromagnetic Band-Gap（EBG） structure would contribute to the EMI reduction for the power bus. In this study, the impedance characteristics of PCB power buses which magnetic materials had adopted in EBG structures were investigated by simulation based on the fast algorithm and segmentation method. It was found that coating the magnetic material onto the inner sides of a power bus could further contribute to the EMI reduction.

关 键 词：印制电路板 电磁带隙 腔模模型 供电系阻抗快速算法 分解元法 磁性材料 

分 类 号：TN41[电子电信—微电子学与固体电子学]