低温化学镀镍的研究及其应用  

Electroless nickel plating in low temperature

作　　者：章兆兰[1] 张博[1] 张溆 何地平[1] 

机构地区：[1]陕西师范大学化学系

出　　处：《陕西师大学报（自然科学版）》1998年第4期71-73,共3页Journal of Shaanxi Normal University(Natural Science Edition)

摘　　要：对低温化学镀镍溶液进行了研究，探讨了镀液主要组分和ｐＨ值对沉积速度的影响．通过溶液的调整、补充及再生，低温化学镀镍溶液可以稳定的使用．此项研究技术已用于电力电容器绝缘瓷套表面金属化的实际生产中．The low temperature nickel plating solution is studied. The main composition of plating solution and the effect of pH on deposit speed are discussed. Through solution of adjustment, supply and revival, the electroless nickel plating solution can be used stably. The technology applied successfully in the production of the metallization for insulated porcelain sleeve on the surface of the power capacitor.

关 键 词：化学镀镍 低温 绝缘瓷套 表面金属化 电力电容器 

分 类 号：TQ153.12[化学工程—电化学工业] TM410.33[电气工程—电器]