非金属材料表面化学镀中活化工艺的改进及发展方向  被引量:24

Improvement and Developing Direction of Activation Technology for Electroless Plating of Nonmetallic Materials

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作  者:秦铁男[1] 马立群[1] 刘敏基[1] 袁亮[1] 丁毅[1] 

机构地区:[1]南京工业大学材料科学与工程学院,南京210009

出  处:《中国表面工程》2010年第1期69-74,共6页China Surface Engineering

摘  要:介绍了国内外对非金属材料表面化学镀前的传统活化工艺诸多改进,并着重叙述了非贵金属催化在非金属表面化学镀前处理中的研究和应用。气相沉积活化、光化学活化和超声活化作为先进的活化技术,在改善活化效果、提高活化效率等方面的优势必将使其成为今后非金属表面化学镀活化工艺的重要发展方向。In this paper, the improvement of traditional activation technology for electroless plating on the nonmetallic materials was introduced. The research and the applications of non-noble metal activation technology in the pretreatment of electroless plating on nonmetallic materials were emphasized. Vapor deposition activation, photochemical activation and ultrasonic wave activation have been seen as the advanced activation technology, whose advantages in the aspects of improving activation effect and increasing activation efficiency will certainly make them to be the important developing direction of activation technology for electroless plating of nonmetallic materials in the future.

关 键 词:非金属材料 化学镀 活化 非贵金属 超声 

分 类 号:TG153.3[金属学及工艺—热处理]

 

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