Cu-Fe基粉末烧结金刚石复合材料界面结合特性  

Interfacial Bonding of Diamond and Matrix in Cu-Fe Powder Sintered Composite

作　　者：李文生[1] 李国全[1] 路阳[1] 袁柯祥[1] 

机构地区：[1]兰州理工大学甘肃省有色金属新材料国家重点实验室,甘肃兰州730050

出　　处：《材料开发与应用》2010年第1期23-25,共3页Development and Application of Materials

基　　金：国家自然科学青年基金项目(50804019);甘肃省科技支撑计划资助项目(090GKCA050)

摘　　要：以Cu-Fe基粉末为基体材料,在真空压力烧结条件下制备了金刚石复合材料。利用扫描电镜、能谱仪、X射线衍射仪等研究粉末与金刚石颗粒界面结合特性。结果表明,930℃、15MPa烧结温度和压力下,烧结胎体中Fe原子向金刚石表面扩散,形成一定厚度的扩散层,并与金刚石中的C发生化学反应生成Cfe15,呈非连续层片状分布于金刚石颗粒表面,实现了金刚石颗粒与金属的化学键结合。Cu-Fe based diamond composite was sintered in a vacuum pressed sintering furnace, and Scanning Electron Microscopy, Energy Dispersive Spectrometer, X-ray Diffraction were used to investigate the bonding interface between diamonds and sintered matrix. The results showed that Fe atoms of the sintered matrix diffused to the diamond surface, and a certain thick diffusion layer of CFe15 had been formed between them under the conditions of sintering temperature 930 ℃ and pressure 15 MPa, the diffusion layer seems to distribute in a non-continuous layer form which achieve a chemical bond between diamonds and the sintered powder metal matrix.

关 键 词：Cu-Fe基粉末 金刚石颗粒 界面结合 真空压力烧结 

分 类 号：TG454[金属学及工艺—焊接]