基于DOE优化光学玻璃晶片边缘磨削工艺  

Optimization of Optics Glass Wafer Edge Grinding Process Based on DOE

作　　者：党兰焕[1] 贺敬良[2] 王学军[2,3] 

机构地区：[1]西南石油大学,四川610500 [2]北京信息科技大学机电工程学院,北京100192 [3]中国电子科技集团公司第四十五研究所,北京101601

出　　处：《半导体技术》2010年第3期228-232,共5页Semiconductor Technology

摘　　要：在光电器件的制造过程中,用光学玻璃晶片作为电路制作的基板材料。玻璃晶片通过在大面积的玻璃面板上划圆获得。划圆后会形成非常锐利的边缘,需要将锐利边缘磨削成圆弧形,以减少在后续加工中产生破损、崩边。在光学玻璃晶片的边缘磨削中,合适的玻璃晶片边缘磨削参数对于晶片边缘磨削后的崩边情况、磨削斜面宽度、中心误差等均有很大影响。利用DOE试验方法,光学玻璃晶片边缘磨削过程中有效减小崩边,并给出了影响因素,获得并验证了最优化的磨削工艺参数,减少了晶片磨削后的崩边破损。In the photoelectron component manufacturing process, optics glass optics glass wafer＇s process is similar to silicon wafer process. The glass wafer will wafer must be used. The be gained through cutting big area glass panel. But the shape bdge will be formed. The shape edge must grinded into round to reduce breakage. During grinding optics glass wafer＇s edge. The appropriate grinding parameter has great influence on edge breakage of glass wafer. The parameters of optics glass wafer edge grinding include edge bevel width ace, the wafer center error and edge breakage etc. A kind of efficient method was introduced to reduce the edge break while grinding the optic glass wafer edge and present affect grinding factors. The edge breakage can be effectivly reduced with DOE method, and the best grinding parameters were gained.

关 键 词：玻璃晶片 边缘磨削 崩边 光电器件 实验设计法 

分 类 号：TN305.1[电子电信—物理电子学]