Microstructure and Mechanical Properties of Nanocrystalline Tungsten Thin Films  

作　　者：H.L. Sun, Z.X. Song, D.G. Guo, F. Ma and K.W. Xu State Key Laboratory for Mechanical Behavior of Materials, School of Materials Science and Engineering, Xi an Jiaotong University, Xi’an 710049, China 

出　　处：《Journal of Materials Science & Technology》2010年第1期87-92,共6页材料科学技术（英文版）

基　　金：supported by the National Basic Re-search Program of China (No. 2004CB619302) ;the National Natural Science Foundation of China (No.50871083, 50771078 and 50771069)

摘　　要：Tungsten （W） thin films were prepared by magnetron sputtering onto Si （100） substrates. Their microstructures were characterized by X-ray diffraction （XRD）, field emission scanning electron microscopy （FE-SEM） and transmission electron microscopy （TEM）. The hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from β-W to α-W structure. In addition, remarkable hardness enhancement both for the deposited and annealed W films, were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.Tungsten （W） thin films were prepared by magnetron sputtering onto Si （100） substrates. Their microstructures were characterized by X-ray diffraction （XRD）, field emission scanning electron microscopy （FE-SEM） and transmission electron microscopy （TEM）. The hardness and modulus were evaluated by nanoindentation. It is found that a 30 nm Cr sticking layer induces structure changes of deposited W film from β-W to α-W structure. In addition, remarkable hardness enhancement both for the deposited and annealed W films, were compared with that of bulk coarse-grained W, although their nanoindentation modulus is very close to that of corresponding bulk W. The intrinsic reasons that lead to structure changes and super hardness are discussed.

关 键 词：Tungsten film Microstructure NANOINDENTATION HARDNESS MODULUS 

分 类 号：TB383.2[一般工业技术—材料科学与工程]