三维塑封充模过程数值模拟方法  

Three-Dimensional Simulation Method of Mold Filling during Microchip Plastic Encapsulation

作　　者：王辉[1] 周华民[1] 李德群[1] 

机构地区：[1]华中科技大学材料成形与模具技术国家重点实验室,武汉430074

出　　处：《上海交通大学学报》2010年第2期176-179,184,共5页Journal of Shanghai Jiaotong University

基　　金：国家自然科学基金资助项目(50875095);国家高技术研究发展计划(863)项目(2009AA03Z104)

摘　　要：针对塑封充模过程,提出了三维塑封充模过程模拟的稳定性数值计算方法.该方法采用N-S方程联合树脂固化反应方程描述三维塑封充模过程,并采用FAN(Flow Analysis Network)方法跟踪流前.为了避免方程求解过程中产生的数值振荡,对动量方程采用GLS(Galerkin LeastSquare)计算格式,对能量方程采用GLS\GGLS(Gradient Galerkin Least Square)相结合的计算格式,对反应方程采用SUPG(Streamline Upwind Petrov Galerkin)计算格式.实验证明,该方法具有较好的稳定性和较高的数值精度.In order to study the filling process of the plastic encapsulation, a stabilized three dimensional simulation method was presented. In this method, N-S equations combined with Kamal conversion equation were introduced as governing equations, and FAN（Flow Analysis Network） technique was used to track melt fronts for each time step. To avoid numerical surge during calculation and achieve stabilized scheme, GLS（Galerkin Least Square） scheme was used in the momentum equation, GLS／GGLS（Gradient Galerkin Least Square） scheme was used in the energy equation, and SUPG（Streamline Upwind Petrov Galerkin） scheme was used in the conversion equation. The experiment proves this method has a good stabilization and accuracy.

关 键 词：塑封 充模 三维数值模拟 

分 类 号：TN305.94[电子电信—物理电子学]