钢基-铍铜在浸涂下结合  

Bonding Beryllium copper to Steel Base by Using Dipping Process

作　　者：吴卫[1] 向军[1] 魏晓伟[1] 

机构地区：[1]四川工业学院

出　　处：《铸造》1998年第11期9-12,37,共5页Foundry

基　　金：四川省教委重点科研项目

摘　　要：将钢棒表面涂上保护剂并预热至６００～７００℃，浸入１１００℃的铍铜合金液中并保持１０～１５秒钟，将有１ｍｍ～２ｍｍ厚的铜层凝固在钢棒的表面上。利用显微分析、电子探针和电子扫描电镜，检测了两种合金结合的界面状况。结果表明，两相金属结合良好，在界面两侧，均发现原子的扩散。在铜侧，铁原子聚集在铜的晶界上。试样表面的维氏显微硬度在铸态和热处理后分别为（平均值）７７和１０２，比纯铍铜试棒的硬度低。Abstract A steel stick brushed with a protective coating,when preheated to 600～700℃,was dipped into beryllium copper melt at 1100℃ for about 10～15s,a copper solidified layer of 1mm～2mm on the surface of steel stick had been achieved,the interfacial bonding characteristics of two alloys was observed using microscope,EPMA and SEM.The test results proved that the bonding interface was jointed soundly.At both sides of the joint,the diffusion of element atoms occurs,the iron atoms are accumulated in the crystal boundaries of the copper.The microhardness values of sample surface at as cast and heat treated state are HV77 and HV 102 respectively,lower than of beryllium copper.

关 键 词：双金属复合材料 浸涂 铍铜 钢 冶金结合 

分 类 号：TB331[一般工业技术—材料科学与工程]