基于LEON3的SOC平台设计与SPI嵌入  

Design of LEON3-Based SOC Platform with an Embedded SPI Module

作　　者：孔璐[1] 吴武臣[1] 侯立刚[1] 朱超[1] 

机构地区：[1]北京工业大学电控学院集成电路与系统研究室,北京100124

出　　处：《微电子学与计算机》2010年第3期173-176,共4页Microelectronics & Computer

摘　　要：提出了一种基于LEON开源微处理器软核的SOC平台构建方案,并通过对软核的重新配置完成了平台的构建.为扩展平台功能,对其加载嵌入了SPI接口模块;完成了VHDL和Verilog定义的接口之间的互相匹配,通过写wrapper的方法将SPI接口转化为AMBAAPB定义的标准类型,成功地实现了两者之间的互连.FPGA验证和GR-MON扫描结果表明,此SOC构建方案可行,并且完整实现了其特征要求.An approach of building the SOC platform based on the LEON open microprocessor IP core is proposed and rumplemented by re-configuration of the core. The SPI is added to the platform to expand the function. Matching between VHDL and Verilog type is completed, and by writing wrapper, the type of SPI interface is successfully transformed into the standard type that defined in AMBA APB. The feasibility of the design is proved through the FPGA verification and GRMON scan, and the features expected are achieved completely.

关 键 词：SOC LEON3微处理器 AMBA SPI接口 WRAPPER 

分 类 号：TP36[自动化与计算机技术—计算机系统结构]