铜双晶体循环变形的晶界强化效应  

STRENGTHENING EFFECT OF GRAIN BOUNDARV ON COPPER BICRYSTAL UNDER CYCLIC LOADING

作　　者：张哲峰[1] 王中光[1] 李广义[1] 

机构地区：[1]中国科学院金属研究所材料疲劳与断裂国家重点实验室

出　　处：《材料研究学报》1998年第6期587-593,共7页Chinese Journal of Materials Research

基　　金：国家自然科学基金!59701006

摘　　要：用组合双晶体（CB）及实际双晶体（RB）研究了平行晶界在用双晶体循环变形过程中的强化作用结果表明随双晶体变小，其循环应力升高，晶界作用增强．扫描电镜观察发现晶界附近出现以次滑移为主的晶界影响区结合双晶体的循环应力-应交响应和晶界影响区，讨论了双晶体的晶界强化机制．The Strengthening effect of grain boundary (GB) on copper bicrystals was investigated by using combined bicrystals (CB) and real bicrystals (RB) with different sizes. It was found that cyclic stress and strengthening effect of GB increased with decreasing the size of the bicrystal RB. Sudece observation showed that a GB affected zone (GBAZ) with second slip system appeared in the vicinity of the GB. Combining the cyclic stress-strain response and the GBAZ, the mechanism of the GB strengthening effect on the bicrystal was discussed.

关 键 词：铜双晶体 循环变形 晶界影响区 晶界强化 

分 类 号：TG111[金属学及工艺—物理冶金]