红外热成像技术在PCB板过孔质量检测中的应用  

Application of infrared thermography in PCB via quality detection

作　　者：刘文霞[1] 张焱[1] 沈京玲[1] 陶宁[1] 

机构地区：[1]首都师范大学,北京100048

出　　处：《激光与红外》2010年第3期254-256,共3页Laser & Infrared

基　　金：国家自然科学基金项目(No.10804078)资助

摘　　要：过孔是多层印刷电路板的重要组成部分之一,在制作过程中会受到钻孔和电镀等工艺技术的限制,无法保证过孔的可靠性,从而影响元器件的电气连接及焊接质量。采用红外热成像法对PCB板过孔质量进行检测。实验结果表明该检测方法可行、有效且检测过程时间短、效率高。Via is an important part of multi-layer PCB,which is restricted by the processes of drilling and plating and become unreliable. In order to prevent the impact of electrical connection and welding quality, it is necessary to ensure the reliability of via. In this paper, a new via quality detection method is introduced which is infrared therrnography. Through many experiments it is found that the detection process is fast, efficient and feasible.

关 键 词：印刷电路板 过孔 可靠性 红外热成像 

分 类 号：TN219[电子电信—物理电子学]