铜离子对镍在玻碳电极上电结晶行为的影响  

Effect of copper ions on behavior of nickel electro-crystallization on glassy carbon electrode

作　　者：刘宇[1] 谭澄宇[1] 贾志强[1] 胡炜[1] 

机构地区：[1]中南大学材料科学与工程学院,有色金属材料科学与工程教育部重点实验室,湖南长沙410083

出　　处：《中南大学学报（自然科学版）》2010年第1期144-149,共6页Journal of Central South University:Science and Technology

基　　金：国家民口配套项目(MKPT-98-106)

摘　　要：利用循环伏安法和恒电位阶跃技术,研究浓度为0.01mol/L铜离子对镍在玻碳电极上电结晶行为的影响。研究结果表明:在含0.01mol/L铜离子的Watts镀液中,电位在-0.3V左右出现铜的还原反应峰,当电位负移到-0.75V时,镍开始结晶沉积;与纯Watts镀液(电位约-0.85V)相比,铜离子的引入促进了镍的电结晶形核和生长,这是因为铜离子的存在降低了镍电结晶形核过电位;在含0.01mol/L铜离子的Watts镀液中,电结晶过程仍基本遵循Scharifker-Hill模型,铜离子的引入并没有改变镍电结晶行为;高负电位下,金属离子的结晶成核方式遵循瞬时成核机制,低负电位下则趋向遵循连续成核机制。Effect of 0.01 mol/L copper ions on the nickel electro-crystallization behavior on glassy carbon electrode （GCE） was investigated by means of chronoamperometry method in conjunction with the cyclic voltammetry （CV） method. The CV curves show that when 0.01 mol/L copper ions are brought into Watts solution, the peak of copper deoxidizing reaction is at potential -0.3 V （vs. SCE） or so and nickel begins to deposit at -0.75 V. Compared with Watts solution （the potential is about -0.85 V）, the entering of copper ions promotes nickel electro-crystallization nucleation/growth because the existence of copper ions debases over-potential of nickel nucleation. Electro-crystallization of Watts solution with 0.01 mol/L copper ions follows Scharifker-Hill model, and the entering of copper ions doesn’t change nickel electro-crystallization behavior. In the case of higher negative potential, the nucleation process of metal ion follows the instantaneous nucleation mechanism. In the case of lower negative potential, it is close to the progressive nucleation mechanism.

关 键 词：电结晶 形核 循环伏安 计时安培 

分 类 号：TG174.44[金属学及工艺—金属表面处理]