聚酰亚胺渗碳复合薄膜的热物理性质  

Thermophysical Properties of Carbon Modified Polyimide Composite Films

作　　者：蔡岸[1,2] 杨莉萍[1] 雒彩云[1] 陈江平[2] 奚同庚[1] 陈新贵[3] 郭敬东[3] 何冠虎[3] 

机构地区：[1]中国科学院上海硅酸盐研究所,上海200050 [2]上海交通大学,上海200240 [3]中国科学院金属研究所,辽宁沈阳110016

出　　处：《材料科学与工程学报》2010年第1期1-4,48,共5页Journal of Materials Science and Engineering

基　　金：国家自然科学基金资助项目(50706057)

摘　　要：应用自行研制的亚微米/微米薄膜材料热物理性质多功能测试仪和差示扫描量热仪(DSC)对聚酰亚胺PI及其渗碳改性复合薄膜PI/C的热膨胀系数、热扩散系数和比热进行了实验研究和理论分析,揭示了在20℃至150℃温区内温度对渗碳量30wt%的PI/C复合薄膜的热物性的影响规律和机制。结果显示渗碳量30wt%的复合薄膜比纯PI热膨胀系数减小,导热性能明显提高,且没有改变性能对温度的依赖关系。对PI/C(30wt%)应用加和原理计算的比热值与实测值相吻合,应用Nielson模型和Cheng-Vachon模型的预测值与导热系数实测值基本吻合。CCD imaging technique,laser flash method and differential scanning calorimeter were utilized to measure the thermal expansion,thermal diffusivity and specific heat of polyimide（PI） films and carbon modified PI composite films（PI/C） at different temperatures.Influences of carbon and temperature on the thermophysical properties of PI/C（30wt%） were analyzed.Results show that the addition of carbon increases the thermal conductivity apparently and decreases thermal expansion between 20℃ and 150℃.The temperature dependences of thermal expansion and thermal conductivity were not changed.The specific heat of PI/C（30wt%） calculated by the addition principle and thermal conductivity of PI/C（30wt%） calculated by the Nielson model and Cheng-Vachon model agree with the measured values.

关 键 词：渗碳聚酰亚胺 热膨胀系数 导热系数 激光脉冲法 CCD非接触法 

分 类 号：TB33[一般工业技术—材料科学与工程]