电镀层均匀性的数值模拟及验证  

Numerical Simulation and Verification on the Uniformity of Electroplated Coating

作　　者：刘太权[1] 

机构地区：[1]华南理工大学,广东广州510640

出　　处：《电镀与环保》2010年第2期11-13,共3页Electroplating & Pollution Control

基　　金：广州市科技计划项目(2008A1-D0011)

摘　　要：采用数值模拟的方法,对电镀中电流密度的变化进行模拟,预测了镀层厚度变化的趋势,解释了这些变化产生的原因。并通过实验研究取样及在扫描电镜下对微观组织的观察,对模拟结果进行了进一步的验证。The changes of current density in electroplating were simulated numerieally; thickness of the electroplated coating was predicted and the reasons for these changes are given. The simulative results were further verified by observing microstructure of the experimental samples with SEM.

关 键 词：电镀 数值模拟 电流密度 实验分析 

分 类 号：TQ153[化学工程—电化学工业]