CPU热柱散热器实验研究与温度场数值模拟  

Experimental Study and Numerical Simulation of Temperature Field on CPU Thermal Pillar Radiator

作　　者：李艳红[1] 刘吉普[1] 

机构地区：[1]湘潭大学机械工程学院,湖南湘潭411105

出　　处：《现代电子技术》2010年第6期178-180,共3页Modern Electronics Technique

摘　　要：对CPU热柱散热器的散热性能进行了实验研究,测试加热功率、风速等主要工况不同时发热电子元件表面的温度,比较并分析了测试结果。运用有限元分析软件ANSYS对该散热器进行了温度场数值模拟分析。研究在风冷条件下,同等尺寸的普通铜柱CPU散热器和热柱散热器的温度分布。结果表明,热柱散热器具有良好的散热性能,在较低风速下也能有效地降低CPU的温度。The performance of CPU thermal pillar radiator is studied, the heating power, wind speed at the main working surface temperature of heating electronic components are tested and compared. Using finite element analysis software ANSYS to the radiator to make the temperature field numerical analysis of this radiator. In the air condition, the same size of ordinary brass pillar CPU radiator and thermal pillar radiator temperature distribution are researched. Results show that the thermal pillar radiator has good heat dissipation performance and can effectively reduce the temperature of CPU at low wind speed.

关 键 词：热柱散热器 散热性能 CPU 数值模拟 

分 类 号：TK124[动力工程及工程热物理—工程热物理] TP332[动力工程及工程热物理—热能工程]