脉冲铜沉积层织构及形貌的研究  

Study on texture and morphology of pulse copper deposit

作　　者：乔瑞华[1] 浦玉萍[1] 张永强[1] 赵鹏[1] 吕广庶[2] 

机构地区：[1]钢铁研究总院粉末冶金研究室,北京100081 [2]北京理工大学材料学院,北京100081

出　　处：《电镀与涂饰》2010年第3期17-19,共3页Electroplating & Finishing

摘　　要：采用脉冲电沉积工艺制备了铜沉积层,研究了电流密度、脉冲频率和占空比对铜镀层织构的影响。利用X射线衍射仪(XRD)和扫描电子显微镜(SEM)分析了铜镀层的织构和形貌。实验结果表明,低电流密度下为(200)晶面择优取向,高电流密度下为(111)晶面择优取向,频率越高则择优取向越强。低频脉冲下制备的沉积层平整致密。The copper deposit was prepared by pulse electroplating process. The effects of current density, pulse frequency and duty cycle on the copper deposit texture were studied. The texture and morphology of copper deposit were analyzed by X-ray diffraction （XRD） and scanning electron microscopy （SEM）, respectively. The test results showed that the preferential orientation is （200） at lower current density and （111） at higher current density; the higher of the pulse frequency, the stronger is the preferential orientation. Smooth and compact copper deposit is obtained at low pulse frequency.

关 键 词：脉冲 铜沉积层 织构 形貌 

分 类 号：TQ153.14[化学工程—电化学工业]