液态Sn-2.8Ag0.5CuX钎料性能的研究  

Investigation on Properties of Melting Sn-2.8Ag0.5CuX Solder

作　　者：杜长华[1] 陈方[1] 甘贵生[2] 雷志阳[1] 付飞[1] 

机构地区：[1]重庆理工大学,重庆400050 [2]北京科技大学,北京100083

出　　处：《稀有金属材料与工程》2010年第3期486-489,共4页Rare Metal Materials and Engineering

基　　金：科技部高新技术项目(2008EG115065);重庆市重点自然科学基金项目(CSTC;2006BA4034)

摘　　要：采用一种新方法制备Sn-2.8Ag0.5CuX亚共晶改性钎料,研究液态钎料的工艺性能。发现原子掺杂能显著改善液态钎料的抗氧化性、润湿性和漫流性,而亚共晶的成分设计既能降低钎料成本,又能延长液态钎料在使用过程中的稳定性。在265℃和大气气氛下,液态钎料表面氧化渣的生成速率仅为0.36mg/cm2·min;当采用RMA-flux钎剂时,t0=0.82s,F3=0.75mN,扩展率接近78%。Sn-2.8Ag0.5CuX modified hypoeutectic solder was prepared by a new method. The processing properties of the liquid solder were studied. The results show that atomic-doping can significantly improve the oxidation resistance, wettability and overflowing ability of melting solder. The hypoeutectic component can reduce the solder cost and extend the stability of the liquid solder in the using process. In the air atmosphere at 265℃, the formation rate of oxide slag on liquid solder surface is only 0.36 mg/cm2 min. When using RMA-flux, the wetting time to is 0.82 s, wetting force F3 is 0.75 mN, and the rate of spread is about 78% for the solder on copper.

关 键 词：电子微连接 Sn-Ag-Cu钎料 液态性能 

分 类 号：TG425.1[金属学及工艺—焊接]