某弹载计算机主机板的热分析研究  

Thermal Analysis of the Main Board in Missile-borne Computer

作　　者：涂远方 

机构地区：[1]北京航天自动控制研究所,北京100854

出　　处：《航天控制》2010年第1期90-95,共6页Aerospace Control

摘　　要：介绍了热分析的基本理论和方法,应用Flotherm散热分析软件对某弹载计算机主机板进行热仿真分析,得出现有条件下主机板的温度分布。通过分析,验证了结构的合理性,并对以后的热控方案提供了一定的参考。The fundamental theory and method is introduced in this paper.Firstly,the whole process of thermal design of the main board in missile-borne computer is carried out based on the principle.Then,the contour from the temperature distribution is obtained by using the thermal analysis software（Flotherm）.Finally,the rationality of this structure is verified by the analysis procedure and it also provides a reference for the selection of the thermal control scheme.

关 键 词：弹载计算机 主机板 热分析 

分 类 号：TG115.25[金属学及工艺—物理冶金]