基于虚拟仪器的动态非接触式硅片测试仪  

Non-contact dynamic silicon wafer tester based on virtual instrument

作　　者：颜友钧[1] 李云飞[2] 

机构地区：[1]苏州市职业大学电子信息工程系,江苏苏州215104 [2]苏州大学计算机科学与技术学院,江苏苏州215002

出　　处：《传感器与微系统》2010年第3期59-61,共3页Transducer and Microsystem Technologies

摘　　要：阐述了动态非接触式硅片测试仪的原理、组成、功能和特点。从虚拟仪器的原理出发,构建了基于虚拟仪器的动态非接触式硅片测试平台,它将电容位移传感器测距技术、电涡流传感器体电阻测试技术和红外光脉冲传感器半导体P/N极性测试技术进行有机的融合,不仅模拟了信号发生器、数字示波器、程控电源、数字万用表等测试仪器,而且,还具有数据管理、运动控制、位置检测等功能,能对太阳能电池硅片厚度、电阻率、P/N极性等参数进行高速、精确检测和动态筛选,是光伏产业大规模生产的必备之选。Principle, composition, functions and features of non-contact dynamic silicon wafer tester are presented. A dynamic non-contact silicon chip test rig is developed based on virtual instrument,which incorporates shift testing of capacitance distance sensor technology, body resistance-testing technology of eddy-current sensor and semiconductor P/N polarity testing technology of infrared optical pulse sensor. The instrument not only simulates the testing instruments such as signal generator, digital oscillograph, programmable power supply and digital muhimeter, but also has the function of data management, moving control, and location test, etc. It is required by large-scale production of photovohaic industry.

关 键 词：虚拟仪器 动态测试 非接触式测量 电容传感器 电涡流传感器 

分 类 号：TP206[自动化与计算机技术—检测技术与自动化装置]