TDE-85/MENA和AG-80/MENA树脂体系的固化机理、弯曲性能及断面形貌比较  

THE KINETICS OF THE CURE REACTION,THREE-POINT BENDING BEHAVIOR AND FRACTURE APPEARANCE OF TDE-85/MENA AND AG-80/MENA EPOXY RESIN SYSTEM

作　　者：郭建君[1] 孙晋良[1] 任慕苏[1] 白瑞成[1] 

机构地区：[1]上海大学复合材料研究中心,上海200072

出　　处：《玻璃钢／复合材料》2010年第2期10-13,共4页Fiber Reinforced Plastics/Composites

基　　金：上海大学创新基金(A10-0110-07-009)

摘　　要：对TDE-85和AG-80环氧树脂进行非等温DSC实验,采用热分析动力学Kinssinger方程对两种树脂体系的放热机理进行分析,得出TDE-85树脂体系的活化能为E=58.9kJ/mol,指前因子A=5.02×106s-1;AG-80树脂体系的活化能为E=50.4kJ/mol,指前因子A=3.99×106s-1。根据DSC升温曲线比较了两种树脂的放热起始温度、放热峰顶温度和结束温度,并以此确定了浇注体固化制度。对两种树脂的浇铸体进行弯曲性能测试,测试得出TDE-85树脂体系浇铸体的弯曲模量达到1580.03MPa,弯曲强度为61.08MPa;AG-80树脂体系的弯曲模量达到了1804.32MPa,弯曲强度为42.64MPa。并采用高倍数码显微镜对断面进行观察,断面形貌显示,AG-80树脂浇铸体断面十分光滑而TDE-85树脂浇铸体断面存在大量水纹状裂纹。The kinetics of the cure reaction for systems of TDE-85/MENA and AG-80/MENA epoxy resin was monitored by the differential scanning calorimetry （DSC）and investigated by the constant heating methods. According to the DSC graphs, the T-β graph extrapolation was used to get the characteristic curing process temperatures, and to confirm the technical parameters of the molding process of the resin system. The kinetic parameters of the curing reaction of TDE-85/MENA epoxy resin such as the overall activation energy Ea = 58.9kJ/mol, the frequency factor A = 5.02 × 10^6s^-1 ; Besides, the kinetic parameters of AG-80/MENA epoxy resin such as the overall activation energy Ea =50. 4kJ/mol,the frequency factor A =3.99× 10^6s^-1 The bending modulus of TDE-85/MENA epoxy resin cast is 1580. 03MPa, and the bending strength of it is 61.08MPa. By comparison, the bending modulus of AG-80/MENA epoxy resin cast is 1804. 32MPa, and the bending strength of it is 42. 64MP. From the photos of the fracture appearance, it has been confirmed that the fracture of AG-80/MENA epoxy resin cast is smooth, and the TDE-85/MENA epoxy resin cast is rough, there are a large number of cracks on it.

关 键 词：非等温DSC Kinssinger方程 弯曲性能 断面形貌 

分 类 号：TQ322[化学工程—合成树脂塑料工业]