GH907合金疲劳蠕变和氢脆的显微分析  

Microstructure Study on the Fatigue Creep and Hydrogen Embrittlement

作　　者：王荣明[1] 张绍维[1] 李春志[1] 颜鸣皋 

机构地区：[1]北京航空材料研究院

出　　处：《材料工程》1998年第12期32-34,共3页Journal of Materials Engineering

基　　金：航空科学基金

摘　　要：运用透射电子显微术分析研究了低膨胀高温合金ＧＨ９０７合金疲劳蠕变断裂试样和充氢试样的显微组织．疲劳蠕变后合金显微组织发生了很大的变化，主要强化相γ变得没有规则，且片状ε相发生断裂；充氢后合金的显微组织变化不大，使合金具有良好的抗氢脆的能力，但由于氢在晶界析出，晶界相与基体的结合力下降，合金的塑性、持久性能略有下降。Microstructures of the low expansion superalloy GH907 have been studied The major strength γ phase becomes irregular and the platelet ε phase splits into pieces in the alloys after fatigue creep However,the microstructure of the alloy remains stable when filled with hydrogen,which indicates excellent anti hydrogen embrittlement of the alloy The plasticity and tensile properties of the alloy decrease a little from the decreased binding strength between the grain boundary phase and the matrix by the hydrogen segregation at the grain boundaries

关 键 词：高温合金 疲劳蠕变 氢脆 显微分析 

分 类 号：TG132.32[一般工业技术—材料科学与工程] TG113.255[金属学及工艺—合金]