热致聚酰胺液晶与尼龙6复合材料的相容性  

Molecular compatibility of polyamide 6 blending with thermal liquid crystalline polyamide

作　　者：井琦[1] 张文熊[1] 刘晶冰[1] 

机构地区：[1]北京工业大学材料科学与工程学院,北京100124

出　　处：《吉林大学学报（工学版）》2010年第2期452-456,共5页Journal of Jilin University:Engineering and Technology Edition

基　　金：北京市自然科学基金项目(D09020001)

摘　　要：采用共溶剂法制备了实验室自行合成的热致液晶聚酰胺(TLCP)与尼龙6(PA6)的复合材料。通过乌氏黏度计、DSC、FT-IR以及SEM等方法分析了复合材料的相容性。加入TLCP后,共混物的特性黏度增加,熔点下降,熔融焓降低;红外图谱证实了TLCP与PA6之间存在分子间氢键作用;SEM的结果表明,当w(TLCP)≥5%时,两相界面模糊,当w(TL-CP)=40%时,共混物呈均相体系,无相分离。以上结果均证实,在不添加第三相增容剂的情况下,引入分子间氢键的作用可以制备出具有良好相容性的PA6/TLCP复合材料。The laboratory synthesized thermotropic liquid crystalline polyamide（TLCP）was solution-blended with polyamide 6（PA6）with different contents.The effects of content of TLCP on the compatibility was investigated by Ubbelohde Viscometer,DSC,FT-IR and SEM.Thermal analyses demonstrate that the addition of TLCP decreases the melting temperature of PA6,exhibiting the compatibility.FT-IR clearly identified a specific intermolecular interaction between PA6 and TLCP due to the similarity in their structures.Particles coprecipitated from the solutions were manifested by SEM that as TLCP content is above 5% the interface becomes ambiguous.When TLCP content is up to 40%,the morphology is homogenous without obvious phase separation due to strong molecular interactions.Characterizations on blends support the idea that the incorporation of hydrogen bond interaction could induce the compatibility of the blends,of which components are in procession of the same amide group in the molecular structure.

关 键 词：有机高分子材料 热致聚酰胺液晶 相容性 PA6 氢键 

分 类 号：TB332[一般工业技术—材料科学与工程]