抛光加工参数对KDP晶体材料去除和表面质量的影响  

Effect of Polishing Parameter on Material Removal and Surface Quality of KDP Crystal

作　　者：王碧玲[1] 高航[1] 滕晓辑[1] 康仁科[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024

出　　处：《人工晶体学报》2010年第1期29-33,43,共6页Journal of Synthetic Crystals

基　　金：国家自然科学基金重点资助项目(No.50535020);山东大学晶体材料国家重点实验室开放基金(KF0904)

摘　　要：针对软脆易潮解KDP功能晶体材料的加工难点,提出了一种基于潮解原理的无磨料化学机械抛光新方法,研制了一种非水基无磨料抛光液,该抛光液结构为油包水型微乳液。通过控制抛光液中的含水量可以方便地控制KDP晶体静态蚀刻率和抛光过程中材料的去除率。实验中还研究了不同加工参数对晶体材料去除率和已加工表面质量的影响。该抛光液的设计为易潮解晶体的超精密抛光加工提供了一条新的技术途径。KDP crystal is extremely soft,brittle and hygroscopic,which make it difficult to form a flawless surface via conventional processing methods.In this paper,chemical mechanical abrasive-free polishing technique based on deliquescence theory was applied to obtain the KDP crystal with super smooth surface.A non-aqueous slurry （W/O structure） was designed to carry out the polishing process.Water concentration in the slurry was changed to control the static etch rate and material removal rate in polishing process.The effect of different parameters such as platen speed and pressure on material removal and surface quality were studied.The design of such slurry provides a new technique for polishing process of hygroscopic crystals.

关 键 词：KDP晶体 无磨料抛光 材料去除 表面质量 

分 类 号：O643[理学—物理化学]