KDP晶体超声辅助磨削的亚表面损伤研究  

Study on the Subsurface Damage of KDP Crystal Ground with Ultrasonic Vibration Assistance

作　　者：王强国[1] 高航[1] 裴志坚[2] 鲁春朋[1] 王碧玲[1] 滕晓辑[1] 

机构地区：[1]大连理工大学精密与特种加工教育部重点实验室,大连116024 [2]堪萨斯州立大学工业与制造系统工程系,曼哈顿66506

出　　处：《人工晶体学报》2010年第1期67-71,共5页Journal of Synthetic Crystals

基　　金：国家自然科学基金重点项目(No.50535020);山东大学晶体材料国家重点实验室开放课题(No.KF0904)

摘　　要：通过采用角度抛光和逐层抛光法以及择优化学腐蚀,对基于超声辅助磨削的KDP晶体试件进行亚表面损伤形式观察以及损伤深度检测,以便为后续加工提供指导。损伤检测实验表明:在超声辅助磨削工艺条件下,亚表面损伤以与磨粒运动方向平行的中位裂纹为主,且裂纹间距具有一定的规律性;亚表面损伤深度为19～48μm,磨头形状(有无倒角)较之磨头磨粒粒度对亚表面损伤深度具有更大的影响,使用有倒角的磨头可得最小亚表面损伤。The KDP workpiece ground with ultrasonic vibration assistance was examined by polishing method and chemical etching so as to show the pattern and the depth of subsurface damage.The data could be meaningful for the subsequent machining.The research shows that with the technical condition in this paper,the subsurface damage was mainly composed of median cracks in the direction of abrasive movement,and the distance between cracks was in a certain trend.The subsurface damage depth was 19-48 μm.Comparing to grits size,the shape of tool head （chamfered or not chamfered） was of a more dominant rule on the depth of subsurface damage.Lower depth of subsurface damage could be obtained using tool with chamfered head.

关 键 词：KDP晶体 磨削 超声辅助加工 亚表面损伤 角度抛光 

分 类 号：O643[理学—物理化学]