溶液温度对铝合金化学镀Ni-W-P三元合金的影响  

The Effect of Temperature on the Electroless Ni-W-P Ternary Alloys Plating on the Aluminum Alloy

作　　者：姚怀[1,2] 苌清华[1] 王喜然[1] 陈艳芳[1] 

机构地区：[1]河南科技大学,洛阳471003 [2]河南省有色金属材料科学与加工技术重点实验室,洛阳471003

出　　处：《表面技术》2010年第2期61-63,共3页Surface Technology

摘　　要：在化学镀中镀液的温度不仅影响施镀过程的沉积速度,而且还将直接影响镀层成分及镀层性能。通过X射线衍射(XRD)、扫描电(SEM)等测试手段着重研究了溶液温度对化学镀Ni-W-P镀层微观组织、相组成、镀速及硬度的影响。结果表明:温度为85℃时,镀层已完全覆盖基体,表面由胞状颗粒组成,大小比较均匀,颗粒直径平均为7μm左右,无明显的缺陷,W的含量高达9.60%,镀态下的硬度高达HV 610左右,镀速为11μm/h。In the chemical plating, the temperature of plating bath in the plating process not only affects the deposition but also has a direct impact on the component and performance of plating. The effect of temperature of plating bath on microstructure, phase composition, depositing velocity and hardness of electroless Ni-W-P plating were changed by XRD,SEM,DTA and so on. The results show that the substrate is covered of Ni-W-P plating completely, the surface is composed of uniform crystalline grains, the contents of W is about 9.60% and no obvious defects, the diameter of grains is about 7μm, the hardness is reach to HV 610and deposition rate is 11μm/h.

关 键 词：化学镀 镍钨磷合金 硬度 镀速 

分 类 号：TQ153[化学工程—电化学工业]