Detection of subsurface defects of fused silica optics by confocal scattering microscopy  

作　　者：马彬 沈正祥 贺鹏飞 季一勤 桑田 刘华松 刘丹丹 王占山 

机构地区：[1]Institute of Precision Optical EngineeringTongji University [2]School of Aerospace Engineering and Applied Mechanics,Tongji University [3]Tianjin Key Laboratory of Optical Thin Films,Tianjin Jinhang Institute of Technical Physics [4]School of Aerospace Engineering and Applied MechanicsTongji University [5]Tianjin Key Laboratory of Optical Thin FilmsTianjin Jinhang Institute of Technical Physics [6]Department of Physics,Qiannan Normal College for Nationalities

出　　处：《Chinese Optics Letters》2010年第3期296-299,共4页中国光学快报（英文版）

基　　金：supported by the National Natural Science Foundation of China(No.10825521);the National"863"Program of China(No.2006AA12Z139);the Shanghai Committee of Science and Technology (No.07DZ22302)

摘　　要：A non-destructive technique for subsurface measurements is proposed by combining light scattering method with laser confocal scanning tomography. The depth and distribution of subsurface defect layers are represented in term of scattered light intensity pattern, and three types of fused silica specimens are fabricated by different grinding and polishing processes to verify the validity and effectiveness. By using the direct measurement method with such technique, micron-scale cracks and scratches can be easily distinguished, and the instructional subsurface defect depths of 55, 15, and 4 μm are given in real time allowing for an in-process observation and detection.A non-destructive technique for subsurface measurements is proposed by combining light scattering method with laser confocal scanning tomography. The depth and distribution of subsurface defect layers are represented in term of scattered light intensity pattern, and three types of fused silica specimens are fabricated by different grinding and polishing processes to verify the validity and effectiveness. By using the direct measurement method with such technique, micron-scale cracks and scratches can be easily distinguished, and the instructional subsurface defect depths of 55, 15, and 4 μm are given in real time allowing for an in-process observation and detection.

关 键 词：Crack detection Defects Grinding (machining) Light Light scattering SCATTERING Silica TOMOGRAPHY 

分 类 号：O436.2[机械工程—光学工程]