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机构地区:[1]华南理工大学化学与化工学院,广东广州510640 [2]广州二轻工业科学技术研究所,广东广州510170
出 处:《电镀与涂饰》2010年第4期1-4,共4页Electroplating & Finishing
基 金:广州市开发区科技创新(引导资金计划)项目(2OO8Q.P088)
摘 要:采用赫尔槽试验和直流电解方法研究了三价铬硫酸盐溶液镀铬工艺。研究结果表明,三价铬硫酸盐溶液快速镀装饰铬的最佳镀液组成和工艺条件为:Cr3+15g/L,主配位剂(甲酸)10mL/L,辅助配位剂15g/L,Na2SO4144g/L,K2SO450g/L,硼酸60g/L,润湿剂1g/L,镀液温度35°C,pH2.5,电流密度12A/dm2。采用这种镀液组成和工艺条件在光亮镍镀层上镀装饰铬,电镀2min和3min获得的光亮铬镀层厚度分别为0.32μm和0.49μm,平均镀速可达0.16μm/min。镀液中的辅助配位剂使镀液的覆盖能力增加,但电镀一定时间后,镀层厚度和平均镀速减小。The process of trivalent chromium plating in a sulfate bath was studied by Hull cell test and direct-current electrolysis. The experimental results showed that the optimal bath composition and technological conditions for rapid trivalent chromium plating are as follows: Cr^3+ 15 g/L, formic acid (as primary complexing agent) 10 mL/L, auxiliary complexing agent 15 g/L, Na2SO4 144 g/L, K2SO4 50 g/L, H3BO3 60 g/L, wetting agent 1 g/L, temperature 35 ℃, pH 2.5, and current density 12 A/dm^2. Under the optimized conditions, bright coatings with thickness of 0.32 μm and 0.49 μm were obtained on bright nickel coatings after plating for 2 min and 3 min, respectively. The average plating rate is 0.16 μm/min. The addition of auxiliary complexing agent is helpful to improve the covering power, but results in the decrease of coating thickness and average plating rate after plating for a period of time.
分 类 号:TQ153.11[化学工程—电化学工业]
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