三价铬电镀的研究现状及发展  

Current Status of Research and Development of Trivalent Chromium Plating

作　　者：杜登学[1] 隋永红[1] 周磊[1] 李文鹏[1] 张志鹏[1] 

机构地区：[1]山东轻工业学院化学工程学院,山东济南250353

出　　处：《材料保护》2010年第4期29-32,共4页Materials Protection

摘　　要：着重阐述了三价铬的发展历史、电镀工艺、阴极反应机理及电镀中存在的问题。对于当前镀铬中存在的问题,从电镀体系的选择、配位剂的选择、阳极及电镀电源的选择、pH值的影响等方面进行了分析与总结。最后对三价铬电镀的发展作了展望。A review was provided of the histo-ry,electroplating technology,cathodic reaction mechanism and existing problems in trivalent chromium electroplating. The exist-ing problems were analyzed and discussed in the light of selection of electroplating system,complexing agent,anode and power source as well as the influence of pH value. Finally,the develop-ment of trivalent chromium electroplating was prospected.

关 键 词：三价铬电镀 反应机理 发展状况 

分 类 号：TQ153[化学工程—电化学工业]