电刷镀纳米晶铜镀层的结构  

Structure of Nano-copper Coating Prepared by the Electric Brush Plating

作　　者：杜锋[1] 李晶[2] 江忠浩[3] 高月德[1] 

机构地区：[1]装甲兵技术学院机械工程系,吉林长春130117 [2]长春理工大学机电工程学院,吉林长春130022 [3]吉林大学材料学院,吉林长春130025

出　　处：《电镀与精饰》2010年第4期8-10,共3页Plating & Finishing

摘　　要：通过X-射线衍射分析、场发射扫描电子显微镜分析、表面原子力显微镜分析及透射电子显微镜观察,得到了电刷镀纳米晶铜镀层为等轴晶粒结构,晶粒d平均为26nm,且分布均匀,主要为大角度晶界结构,不存在微观裂纹、微孔及明显的晶体织构。The electric brush plating Nano-copper films were researched by means of XRD, SEM, AFM, TEM. The results show that they were in equality axis crystal with average grain size of 26 nm and large- angle crystal boundary,without evident crystal texture and microcrack and pinhole.

关 键 词：电刷镀 纳米晶 铜镀层 微观结构 

分 类 号：TQ153.14[化学工程—电化学工业]