蒸汽压力作用下黏弹性半平面问题的断裂分析  

Fracture analysis of viscoelastic half-plane subjected to vapor pressure loadings

作　　者：张锋伟[1] 王松[2] 覃小军[2] 张能辉[2,3] 

机构地区：[1]甘肃农业大学工学院,兰州730070 [2]上海市应用数学和力学研究所,上海200072 [3]上海大学理学院,上海200444

出　　处：《兰州大学学报（自然科学版）》2010年第2期111-116,共6页Journal of Lanzhou University(Natural Sciences)

基　　金：国家自然科学基金项目(10872121);上海市自然科学基金项目(07ZR14037);上海市教育委员会科研创新项目(09YZ07);国家自然科学基金重大项目(90816001);国家杰出青年基金项目(10725209);上海市重点学科建设项目(S30106)

摘　　要：研究了蒸汽压力作用下黏弹性半平面的断裂问题.利用Fourier变换法、Jacobi多项式方法和黏弹性对应原理,获得了弹性和黏弹性半平面中裂纹的应力强度因子、张开位移和滑移位移.数值算例揭示了蒸汽压力作用下弹性半平面中裂纹应力强度因子与回流焊时间、几何尺寸的关系,以及黏弹性参数对裂纹张开位移和滑移位移稳态和瞬态响应的影响.Fracture problems of viscoelastic half-plane subjected to vapor pressure loadings were analyzed. The Fourier transformation method, the Jacobi polynomial method and the viscoelastic corresponding principle were used to obtain stress intensity factors （SIF）, opening and sliding displacements for a crack in an elastic or viscoelastic half-plane. Numerical calculations the SIF, the reflow soldering time and the geometry size were carried out to reveal the relationships among in the elastic half-plane under vapor pressure loadings, and to study the effects of viscoelastic parameters on the steady-state and transient responses of crack opening and sliding displacements in the viscoelastic half-plane under vapor pressure loadings.

关 键 词：黏弹性 蒸汽压力 半平面问题 断裂分析 

分 类 号：O345[理学—固体力学]