含Cu的Al-Mg-Si合金微观组织及耐热性能的研究  

Effect of Cu Addition on Microstructure and Heat-resistant Property of Ak-Mg-Si Alloy

作　　者：金曼[1] 邵光杰[1] 杨丽丽[1] 

机构地区：[1]上海大学材料科学与工程学院,上海200072

出　　处：《热处理》2010年第2期23-26,共4页Heat Treatment

基　　金：国家自然科学基金资助项目(50801044);上海大学创新基金;上海高校选拔培养优秀青年教师科研专项基金

摘　　要：主要研究了添加铜元素对6082 Al-Mg-Si合金微观组织及耐热性能的影响。研究表明,添加Cu提高了Al-Mg-Si合金的峰值硬度并缩短了合金达到峰值硬度的时间;添加0.6%Cu的合金在170℃时效4 h后,合金中形成了板条状析出相Q′;在250℃等温不同时间后,含Cu合金的硬度明显高于不含Cu的合金,说明添加Cu可以提高Al-Mg-Si合金的耐热性能。The effect of addition of copper element on the microstructure and thermal stability of 6082 Al-Mg-Si alloy was investigated. The results show that Cu addition can enhance the peak hardness of the alloy and reduce the time to reach the peak hardness and the lathy precipitate Q＇ will be formed in Al-Mg-Si alloy with 0.6% Cu while being aged at 170 ℃ for 4 h, and that the hardness of the alloy with Cu will be always appreciably higher than that of the alloy without Cu after heating at 250 ℃ for different times, which indicates that the addition of copper can improve on the heat-resistant property of Al-Mg-Si alloy.

关 键 词：Al-Mg—Si合金 时效 析出相 耐热性能 

分 类 号：TG146.21[一般工业技术—材料科学与工程]