真空触头成分及超微结构对其耐电压强度的影响  

Influence of Composition and Microstructure on the Dielectric Strength of Vacuum Contact

作　　者：郑冬琴[1] 

机构地区：[1]暨南大学物理系

出　　处：《暨南大学学报（自然科学与医学版）》1998年第3期29-32,共4页Journal of Jinan University(Natural Science & Medicine Edition)

摘　　要：以普遍使用的Ｃｕ－Ｃｒ合金为基础，分析了影响真空触头材料耐电压强度的因素．通过分析真空触头材料击穿前后的成分与组织的变化，发现触头合金的成分和微观组织结构与其耐电压强度有着密切的关系．材料表面固溶体的形成有利于耐电压强度的提高；材料表面成分的均匀化也可以使材料具有更好的耐电压性能．On the base of widely used contact material Cu Cr alloys,the factors influence the dielectric strength of contact materials are studied. It is found that the composition and microstructure have intimate relation with dielectric strength through the change of microstructure after discharge. Experimental results show that the dielectric strength increases when solid solution is formed and the dielectric strength will become higher when compositions are evenly distributed on the surface of contact materials.

关 键 词：触头材料 耐电压强度 超微结构 真空触头材料 

分 类 号：TM503.5[电气工程—电器]