SnAgCu和SnPb焊锡在含活性剂介质中的电化学腐蚀性能  

Electrochemical Corrosion Behavior of SnAgCu and SnPb Solder Alloys in Solution with Activator

作　　者：薛静[1] 赵麦群[1] 李涛[1] 高鹏[1] 

机构地区：[1]西安理工大学材料科学与工程学院,西安710048

出　　处：《腐蚀与防护》2010年第4期283-286,290,共5页Corrosion & Protection

基　　金：陕西省自然科学研究计划资助项目(2002E111)

摘　　要：用动电位极化法研究了无铅焊锡合金Sn-3.0Ag-0.5Cu和锡铅焊锡合金Sn-37Pb在20℃、0.1mol/L乙二酸水溶液中的电化学腐蚀性能,并与其在相同温度下的0.1 mol/L NaCl水溶液中的性能进行了比较,利用扫描电子显微镜(SEM)、X射线能谱仪(EDS)和X射线衍射仪(XRD)分析了腐蚀产物的形貌和成分。结果表明:在两种腐蚀溶液中,Sn-3.0Ag-0.5Cu的耐蚀性能均优于Sn-37Pb。在0.1 mol/L乙二酸水溶液中,两种焊锡都产生了电化学钝化,表面腐蚀产物均为草酸亚锡,其钝化机理符合成相膜理论。而在0.1 mol/L NaCl水溶液中,两种焊锡均无钝化现象。The electrochemical corrosion behavior of lead-free Sn-3.0Ag-0.5Cu and Sn-37Pb solder alloys in 0.1 mol/L oxalic acid solution at 20℃was investigated by potentiodynamic polarization method and compared with the results in 0.1 mol/L NaCl solutioa The corrosion products were observed by SEM and the chemical components were examined by EDS and XRD.The results showed that Sn-37Pb solder had poor corrosion resistance compared with Sn- 3.0Ag-0.5Cu in both two media.In oxalic acid solution two solders ethibited passivation,and the corrosion products were stannous oxalate mainly,the passivation mechanism of the solders accorded with the film forming theory.But there was no passivation phenomenon in 0.1 mol/L NaCl solution.

关 键 词：锡银铜焊锡 锡铅焊锡 电化学腐蚀 动电位极化 乙二酸 

分 类 号：TG146[一般工业技术—材料科学与工程] TG174.3[金属学及工艺—金属材料]