半导体制冷的大功率LED模组散热模拟  

Heat Dissipation Simulation of High-power LED Module Cooling by Semiconductor Refrigerator

作　　者：郑同场[1] 李炳乾[2] 夏正浩[1,2] 

机构地区：[1]华南师范大学光电子材料与技术研究所,广州510631 [2]佛山科技学院物理系,广东佛山528000

出　　处：《半导体光电》2010年第2期210-212,229,共4页Semiconductor Optoelectronics

摘　　要：基于热电制冷原理,对采用半导体制冷器制冷的50W大功率LED模组系统散热进行模拟,研究了大功率LED结温(Tj)、半导体制冷器工作状态(冷热端温差ΔT)、散热器热阻(Θh-a)间的关系。模拟结果表明,采用半导体制冷的LED模组系统,存在一个Θh-a的最大限制值,只有Θh-a小于这一限制值时制冷器才能降低LED结温;随着所设计的制冷器ΔT增加,其制冷效率下降,而所要求的散热器散热强度先降低后升高;当Θh-a为定值时,制冷器的ΔT有一个最佳范围;使用多级半导体制冷来给LED模组系统散热更具有价值。Based on the principle of thermoelectric refrigeration, the heat dissipation of high-Power LEDs module cooling by semiconductor refrigerator is simulated. The relationship among the LED junction temperature （Tj）, refrigerator working state（temperature difference ΔT）, and heat resistance of heat sink（Θh-a） is investigated. The simulation results show that the high-power LEDs system cooling by refrigerator owns a maximum value of Θh-a, only below which the refrigerator can reduce the LED Tj. With the increase of ΔT, the refrigerating efficiency declines, but the required heat dissipation intensity decreases then increases. There is an optimal range of ΔT to decrease the LED Tj when the Θh-a is a constant. Using the multi-stage semiconductor refrigerator to cool the high-power LED system is more significant.

关 键 词：大功率LED 半导体制冷器 制冷系数 散热器热阻 

分 类 号：TN383.1[电子电信—物理电子学]