Cu(Ⅱ)印迹壳聚糖交联多孔微球去除水溶液中金属离子  

REMOVAL OF METAL IONS FROM AQUEOUS SOLUTION USING Cu(Ⅱ) IMPRINTED CHITOSAN CROSS-LINKED POROUS MICROSPHERES

作　　者：石光[1] 胡小艳[1] 郑建泓[1] 孙丰强[1] 

机构地区：[1]华南师范大学化学与环境学院,广州510631

出　　处：《离子交换与吸附》2010年第2期103-110,共8页Ion Exchange and Adsorption

基　　金：国家自然科学基金(50503008)

摘　　要：研究了以Cu2+为模板的壳聚糖交联多孔微球(Cu-CSCPM)对溶液中Cu2+的吸附性能,为该材料应用于去除废水、果蔬汁等有毒重金属铜离子提供理论基础。首先制备了Cu2+印迹壳聚糖交联多孔微球,并表征了微球的一些物理化学性质;其次采用静态吸附法研究了该微球对Cu2+的吸附行为。结果发现,制得的微球表面多孔,含有活性-NH2,其含水量为69.59%,树脂骨架密度为1.22g/cm3,孔度值为73.68%,交联度为82.42%。初始浓度为60mmol/L、吸附温度40℃、pH=4.0时,Cu-CSCPM对Cu2+的饱和吸附容量为1.89mmol/g。Cu-CSCPM再生5次对Cu2+仍然具有较高吸附容量。The aim of this research is to study the adsorption behavior of Cu^2＋ imprinted chitosan cross-linked porous micriospheres （Cu-CSCPM） towards Cu^2＋ in aqueous solution, so that some theoretical basis of the application of Cu-CSCPM on eliminating metal ions which existed in waste water, juice and vegetable can be obtained. First, Cu-CSCPM was prepared with chitosan as raw material and Cu^2＋ as ionic templated, and some physicochemical properties of Cu-CSCPM were characterized. Second, adsorption behavior of Cu^2＋ on Cu-CSCPM was investigated by the batch method. The results showed that the surface of microspheres was highly porous. Some physical properties of the Cu-CSCPM were as follows： water content was 69.59%, skeletal density （ρT） was 1.22g/cm^3, porosity （P） was 73.68%, crosslinking degree was 82.42%. The saturated adsorption capacity of Cu-CSCPM for Cu^2＋ was 1.89mmol/g when initial concentration was 60mmol/L, adsorption temperature was 40℃ and pH 4.0. Cu-CSCPM still showed a high adsorption capacity after five times regeneration.

关 键 词：壳聚糖交联多孔微球 Cu2+模板 预交联 交联 吸附 

分 类 号：O636.1[理学—高分子化学]