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机构地区:[1]四川大学高分子科学与工程学院,四川成都610065
出 处:《塑料科技》2010年第5期31-35,共5页Plastics Science and Technology
摘 要:通过熔融共混法将热塑性弹性体氢化苯乙烯-丁二烯-苯乙烯嵌段共聚物(SEBS)和低密度聚乙烯(LDPE)制成形状记忆聚合物(SMP)材料;在SMP材料中填充导电炭黑(CB),制成具有电致形状记忆特性的LDPE/SEBS/CB复合材料。通过SEM、DSC分析和力学性能、电性能、记忆性能测试,研究了CB含量对电致SMP材料结构与性能的影响。结果表明:当CB含量达到20%时,LDPE/SEBS/CB复合形状记忆材料的体积电阻率降至103Ω·cm左右,CB的导电网络趋于稳定;并且LDPE/SEBS/CB(2:2:1)复合形状记忆材料的形状固定率约90%,常温拉伸和高温拉伸时均表现出较高的形状回复率(约90%),拉伸模量约170MPa,拉伸强度约9.5MPa,断裂伸长率约400%。Shape memory polymer(SMP) were prepared with thermoplastic hydrogenated styrenebutadiene-styrene block copolymer(SEBS) elastomer and low-density polyethylene(LDPE) by melt-blending process,and the electro-induced SMP was obtained by adding conductive carbon black(CB) into SMP.The effects of CB content on the structure and properties of electroinduced SMP were studied by SEM,DSC analysis,mechanical property,electrical property and memory behavior tests.The results showed that when the content of CB reached 20%,the volume resistivity of LDPE/SEBS/CB composites SMP was about 103Ω·cm,and the conductive network tended to be stable;the shape f ixed rate of LDPE/SEBS/CB(2:2:1) composites SMP was about 90%;and its electro-induced shape recovery ratio was about 90% under the condition of high temperature tensile or normal temperature tensile;the tensile modulus was about 170 MPa,the tensile strength and fracture elongation was about 9.5MPa and 400%.
关 键 词:低密度聚乙烯 氢化苯乙烯-丁二烯-苯乙烯嵌段共聚物 电致 形状记忆聚合物 导电炭黑
分 类 号:TB332[一般工业技术—材料科学与工程]
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