新型中温金基钎料研究  

Research of New Mid-temperature Solder of Au-baseis Alloy

作　　者：刘泽光[1,2] 陈登权[1,2] 李伟[1,2] 许昆[1,2] 罗锡明[1,2] 郭根生[1,2] 

机构地区：[1]贵研铂业股份有限公司 [2]昆明贵金属研究所,云南昆明650106

出　　处：《贵金属》2010年第2期41-48,共8页Precious Metals

基　　金：国家科技支撑计划课题资助项目(2007BAE26B01)

摘　　要：研究了一种微电子器件高温封装用Au—In共晶型中温金基钎料合金，钎料由77％～75％Au和23％～25％In（质量分数）构成，规格为0．03～0．10mm，钎料箔带材是采用多层叠加轧制方法制造的。实验结果表明，在保护气氛下，500～520℃无钎剂钎焊，钎料对镀金可伐合金和无氧铜、纯镍、纯银等多种母材具有优良的漫流性和间隙填充性，钎焊接头牢固、钎料箔带材塑性高，应用工艺性能良好。A new type eutectic Au -In mid -temperature solder was investigated for microelectronic de- vice high temperature packaging technology. The solder composition is Au 77% -75% , In 23% -25%. The solder foil strip of 0.03 - 0. 10 mm was fabricated by the multi - layered compound rolling method . The experimental results indicated that the solder alloy used for soldering plated gold kovar alloy and the oxygen - free copper, the pure nickel, the pure silver and other many kinds of parent metals has the fine flowability and the gap filled property at conditions of the protective atmosphere and 500 - 520℃ the flux- less. The soldering joint is reliable. The solder foil strip has high plasticity and the good technological property for application.

关 键 词：复合材料 金合金 中温 钎料 

分 类 号：TG146.31[一般工业技术—材料科学与工程]