脱粘缺陷对粘接结构频散特性的影响  

Influences of disbond defects on the dispersion property of adhesive bonding structure

作　　者：常新龙[1] 尼涛[1] 艾春安[1] 赵文才[1] 

机构地区：[1]第二炮兵工程学院,西安710025

出　　处：《应用声学》2010年第3期227-235,共9页Journal of Applied Acoustics

摘　　要：采用全局矩阵理论,通过引入内聚强度弱化模型和弹簧模型,计算了脱粘缺陷对粘接结构频散特性的影响。分析了内聚强度缺陷、界面缺陷及混合缺陷等因素对粘接结构频散特性的影响,发现频散曲线的演化规律与材料声学性质密切相关。不同材料和不同组合,其规律有很大不同。针对各向同性粘接结构,可能通过考察特定频率段内频散模态的变化,实现对脱粘缺陷的检测。For assessing the influences of disbond defects on the dispersion property of adhesive bonding structure, an improved global matrix method is introduced, and the defects are described by the cohesive strength degradation mode and the spring mode. In this paper, cohesive strength failure, interface failure and the mixed failure are analyzed. The evolution regularity of dispersive curves strongly depends on the acoustic propertie of the material, which maybe distinct for different materials and plying manners. For the adhesive bonding of isotropic materials, the disbond defects may be detected by measuring the variety of the dispersive modes in a special frequency band.

关 键 词：粘接结构 内聚强度弱化 弹簧模型 脱粘 频散曲线 

分 类 号：O426.2[理学—声学]