基于FPGA的电磁超声测厚仪  

Development of Thickness Gauge Using EMAT Based on FPGA

作　　者：段伟亮[1] 康磊[1] 张晓辉[1] 王淑娟[1] 翟国富[1] 

机构地区：[1]哈尔滨工业大学军用电器研究所,黑龙江哈尔滨150001

出　　处：《仪表技术与传感器》2010年第4期14-16,19,共4页Instrument Technique and Sensor

摘　　要：为了改善测厚系统抗干扰能力、降低系统复杂度、提高测量效率,研制了一种基于FPGA的电磁超声测厚仪。设计了基于FPGA的回波信号处理模块,实现了电磁超声回波信号的实时处理;采用SOPC技术,增强了软件灵活性,简化了系统硬件电路。实验结果表明:该测厚仪具有无需声耦合剂、抗干扰能力强、检测效率较高等特点,分辨力可达0.1 mm.In order to improve the capability of anti-jamming,reduce complexity and improve efficiency of the thickness gauging system,a thickness gauge using EMAT based on FPGA was developed.A signal processing module,designed in the FPGA,implemented real-time processing of the EMAT echo signal.The SOPC technology,which was utilized in the system,enhanced the flexibility of the software and simplified the hardware design.It is proved that the thickness gauge is couplant-free,anti-jamming and efficient,and its resolution capacity is up to 0.1 mm.

关 键 词：电磁超声换能器 测厚仪 FPGA SOPC 

分 类 号：TP274.53[自动化与计算机技术—检测技术与自动化装置]