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机构地区:[1]北京工业大学材料科学与工程学院,北京100124
出 处:《焊接学报》2010年第4期81-84,共4页Transactions of The China Welding Institution
基 金:北京市科技新星计划基金资助项目(2004B03)
摘 要:内生法制备复合钎料被认为是提高无铅钎料性能的有效途径.为了提高基体钎料的综合性能,试验采用内生均匀分布的Cu6Sn5颗粒作为增强相,以Sn-3.5Ag共晶钎料作为基体,制成内生Cu6Sn5颗粒增强的SnAg基复合钎料.研究了服役条件下内生Cu6Sn5颗粒增强复合钎料的显微组织和抗剪强度,对复合钎料钎焊接头的断裂方式及增强相的作用进行了分析.结果表明,随着再流及时效的进行,复合钎料内部Cu6Sn5颗粒的形貌及尺寸发生变化,进而影响复合钎料钎焊接头的抗剪强度.复合钎料钎焊接头的变形方式主要受滑移带控制,内生Cu6Sn5颗粒增强相可以起到阻碍滑移带扩展的作用.In-situ particle-reinforced composite solder was considered as an effective method to enhance the properties of lead-free solders.In-situ Cu6Sn5 particles were added into the eutectic Sn-3.5Ag solder to form in-situ metal particles enhanced SnAg-based composite solder.The microstructure and mechanical properties of the composite solder joint during reflow and isothermal aging were investigated,and the fracture mode of composite solder joint and the role of in-situ Cu6Sn5 particles were analyzed.Experimental results show that the microstructure and dimensions of in-situ Cu6Sn5 particles in composite solder matrix have changed during reflow and isothermal aging.So the shear strengths of composite solder joints have influenced by the sizes of in-situ Cu6Sn5 particles.Besides,the deformation of composite solder joint is dominated by shear bonding mode,and the in-situ Cu6Sn5 reinforced particles can retard the fracture path of shear bonds.
关 键 词:内生Cu6Sn5颗粒 复合钎料 再流 时效 抗剪强度
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