聚酰亚胺薄膜粘接接头内胶黏剂热分解动力学的计算  

The Measurement of Heat Decomposition Dynamics of the Adhesive in Adhesive-PI Joints

作　　者：叶险峰[1] 白洪刚[2] 李冰[1] 

机构地区：[1]黑龙江省科学院石油化学研究院,黑龙江哈尔滨150040 [2]中国地震局工程力学研究所,黑龙江哈尔滨150080

出　　处：《化学与粘合》2010年第3期72-74,共3页Chemistry and Adhesion

摘　　要：利用X射线能谱(EDX)分析可以确定不同条件下粘接接头内胶黏剂的元素组成及其变化行为。由于胶黏剂和聚酰亚胺薄膜组成成分不同,可以利用X射线能谱计算出胶黏剂的热失重率,从而计算出聚酰亚胺薄膜粘接接头内胶黏剂的热分解动力学,并和空气环境下胶黏剂热分解活化能进行比较,表明粘接接头内胶黏剂的热分解速率低于空气环境下胶黏剂热分解速率。这种分析测试方法为原位表征粘接接头的性能提供了一种新的分析方法。EDX analysis method can measure the dements contents and changes of the adhesive in adhesive-Pl joints. There are different elements contents and changes between the adhesive and PI film, the weight loss of the adhesive in adhesive-PI joints can be measured with EDX, so the heat decomposition dynamics of the adhesive in the joints can be calculated. Compared with the values of heat decomposition energy of the adhesive under different＇conditions, it is indicated that the heat decomposition energy of the adhesive in the joints is lower.than that of the adhesive in air atmosphere. This analysis method is a new method for measuring the properties of adhesive in the joints.

关 键 词：计算 粘接接头 热分解动力学 

分 类 号：TQ433.433[化学工程]