Recrystallized microstructural evolution of UFG copper prepared by asymmetrical accumulative rolling-bonding process  

作　　者：王军丽 史庆南 钱天才 王绍华 杨喜昆 

机构地区：[1]Research Center for Analysis and Measurement,Kunming University of Science and Technology

出　　处：《Transactions of Nonferrous Metals Society of China》2010年第4期559-563,共5页中国有色金属学报（英文版）

基　　金：Projects(50804018,50564005)supported by the National Natural Science Foundation of China;Project(2003E0003Z)supported by the Key Science Foundation of Yunnan Province,China;Project(08Y0055)supported by Scientific Research Fund of Yunnan Provincial Education Department,China;Project(2008-055)supported by Talents Cultivation Foundation of Kunming University of Science and Technology,China

摘　　要：Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding(AARB)with the strain of 3.2.The effects of annealing temperature and time on microstructural evolution were studied by means of electron backscattered diffraction(EBSD).EBSD grain mapping,recrystallization pole figure and grain boundary misorientation angle distribution graph were constructed,and the characteristics were assessed by microstructure,grain size,grain boundary misorientation and texture.The results show that ultra fine grains(UFG)are obtained after annealing at 250℃ for 30?40 min.When the annealing is controlled at 250℃for 40 min,the recrystallization is finished,a large number of small grains appear and most grain boundaries consist of low-angle boundaries.The character of texture is rolling texture after the recrystallization treatment,but the strength of the texture is faint.While second recrystallization happens,{110}<1ī2>+{112}<11ī> texture component disappears and turns into{122}<212>cube twin texture component.Copper sheet with grain size of 30-60μm was processed by plastic deformation of asymmetrical accumulative rolling-bonding（AARB）with the strain of 3.2.The effects of annealing temperature and time on microstructural evolution were studied by means of electron backscattered diffraction（EBSD）.EBSD grain mapping,recrystallization pole figure and grain boundary misorientation angle distribution graph were constructed,and the characteristics were assessed by microstructure,grain size,grain boundary misorientation and texture.The results show that ultra fine grains（UFG）are obtained after annealing at 250℃ for 30？40 min.When the annealing is controlled at 250℃for 40 min,the recrystallization is finished,a large number of small grains appear and most grain boundaries consist of low-angle boundaries.The character of texture is rolling texture after the recrystallization treatment,but the strength of the texture is faint.While second recrystallization happens,{110}〈1ī2〉＋{112}〈11ī〉 texture component disappears and turns into{122}〈212〉cube twin texture component.

关 键 词：severe deformation asymmetrical accumulative rolling-bonding ultra fine grains COPPER 

分 类 号：TG339[金属学及工艺—金属压力加工]